applications buck or boost inductor cellular phones/ pdas led photo flash lcd displays handheld/mobile devices gps systems digital cameras mp3 players environmental data storage temperature range: -40? to +125? operating temperature range: -40? to +125? (ambient plus self-temperature rise) solder reflow temperature: j-std-020d compliant packaging supplied in tape and reel packaging, 4,500 parts per reel 13 diameter reel pb halogen hf free description halogen free 125? maximum total temperature operation 3.2 x 3.0 x 1.2mm maximum shielded drum core ferrite core material high power density, ultra-compact footprint inductance range from 1.02 h to 97.7 h current range from 0.217 to 1.95 amps magnetically shielded, low emi rohs compliant low profile, high power, shielded drum inductors sdh2812 series 1209 bu-sb091134 page 1 of 4 data sheet: 4354 smd device 1 open circuit inductance (ocl) test parameters: 100khz, 0.10v rms , 0.0adc 2i rms : dc current for an approximate temperature rise of 40? without core loss. derating is necessary for ac currents. pcb pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. it is recommended the part temperature not exceed 125? under worst case operating conditions verified in the end application. 3i sat : peak current for approximately 30% rolloff at +25?. 4 k-factor: used to determine b p-p for core loss (see graph). b p-p = k * l * i. b p-p (gauss), k: (k-factor from table), l: (inductance in h), i (peak-to-peak ripple current in amps). 5 part number definition: sdh2812-xxx-r ?sdh2812 = product code and size ?xxx= inductance value in h, r = decimal point, if no r is present then 3 rd digit equals number of zeros. ??r suffix = rohs compliant product specifications part ocl 1 part marking i rms 2 i sat 3 @ 25? dcr ( ) @ 20? dcr ( ) @ 20? number 5 ( h) designator (amps) (amps) (typical) (maximum) k-factor 4 sdh2812-1r0-r 1.02?0% o 1.45 1.95 0.062 0.083 1212 sdh2812-1r5-r 1.50?0% a 1.33 1.71 0.082 0.102 1070 sdh2812-2r2-r 2.20?0% b 1.26 1.53 0.095 0.114 866 SDH2812-3R3-R 3.20?0% c 1.08 1.16 0.138 0.154 673 sdh2812-4r7-r 4.20?0% d 0.900 1.000 0.200 0.224 587 sdh2812-6r8-r 6.60?0% e 0.730 0.830 0.270 0.336 466 sdh2812-8r2-r 8.17?0% f 0.660 0.780 0.380 0.417 404 sdh2812-100-r 9.67?0% g 0.620 0.710 0.389 0.467 387 sdh2812-150-r 14.7?0% h 0.500 0.570 0.620 0.721 308 sdh2812-220-r 21.6?0% i 0.440 0.460 0.870 0.922 264 sdh2812-330-r 33.2?0% j 0.350 0.380 1.37 1.43 209 sdh2812-470-r 46.7?0% k 0.300 0.320 1.72 1.99 173 sdh2812-680-r 68.0?0% l 0.270 0.270 2.46 2.70 148 sdh2812-820-r 82.2?0% m 0.230 0.240 3.15 3.47 135 sdh2812-101-r 97.7?0% n 0.217 0.218 3.61 3.97 122
top view side view bottom view recommended pad layout schematic 1 2 x x 2.8 0.2 3.0 0 .2 1 2 1.54 0.2 1.54 0.2 0.73 0.2 1.54 typ. 1.2 max. 2 1 2.0 (2plcs) 1.60 1.0 (2plcs) dimensions - mm x x 1.2 dia. a a bb 1 2 a-a view 12.00.30 5.5 10.2 4.0 8.0 3.10 3.30 1.30 2.0 b-b view direction of feed 1.5 dia. 0 10 20 30 40 50 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 total loss (w) temperature rise (oc) two-digit (2) part marking: 1 st digit indicates inductance value per ?art marking designator column in product specifications table 2 nd digit indicates bi-weekly production date code supplied in tape-and-reel packaging, 4,500 parts per reel, 13 diameter reel. packaging information - mm temperature rise vs. total loss 1209 bu-sb091134 page 2 of 4 data sheet: 4354
1209 bu-sb091134 page 3 of 4 data sheet: 4354 core loss vs. b 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 10000 b (g u a s s ) core loss (w) 100khz 200khz 300khz 500khz 1m hz p-p p-p % of ocl vs. % of i sa t 0% 20% 40% 60% 80% 100% 0% 20% 40% 60% 80% 100% 120% 140% 160% % of i sa t % of ocl +25c +85c -40c inductance characteristics core loss
1209 bu-sb091134 page 4 of 4 data sheet: 4354 the only controlled copy of this data sheet is the electronic read-only version located on the cooper bussmann network drive. al l other copies of this document are by definition uncontrolled. this bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end use r with design applications. cooper bussmann reserves the right, with- out notice, to change design or construction of any products and to discontinue or limit distribution of any products. cooper bus smann also reserves the right to change or update, without notice, any technical information contained in this bulletin. once a product has been selected, it should be tested by the user in all possib le applications. life support policy: cooper bussmann does not authorize the use of any of its products for use in life support devices or system s without the express written approval of an officer of the company. life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance wi th instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. north america cooper electronic technologies 1225 broken sound parkway nw suite f boca raton, fl 33487-3533 tel: 1-561-998-4100 fax: 1-561-241-6640 toll free: 1-888-414-2645 cooper bussmann p.o. box 14460 st. louis, mo 63178-4460 tel: 1-636-394-2877 fax: 1-636-527-1607 europe cooper electronic technologies cooper (uk) limited burton-on-the-wolds leicestershire ?le12 5th uk tel: +44 (0) 1509 882 737 fax: +44 (0) 1509 882 786 cooper electronic technologies avda. santa eulalia, 290 08223 terrassa, (barcelona), spain tel: +34 937 362 812 +34 937 362 813 fax: +34 937 362 719 asia pacific cooper electronic technologies 1 jalan kilang timor #06-01 pacific tech centre singapore 159303 tel: +65 278 6151 fax: +65 270 4160 ? 2009 cooper bussmann st. louis, mo 63178 www.cooperbussmann.com solder reflow profile temperature t t p t s t c -5c time 25c to peak time 25c t smin t smax t l t p preheat a max. ramp up rate = 3c/s max. ramp down rate = 6c/s t t a a b b l l e e 1 1 - - s s t t a a n n d d a a r r d d s s n n p p b b s s o o l l d d e e r r ( ( t t c c ) ) vol u me vol u me packa g emm 3 mm 3 thickne ss <350 > _ 350 <2.5mm 235 c 220 c > _ 2.5mm 220 c 220 c t t a a b b l l e e 2 2 - - l l e e a a d d ( ( p p b b ) ) f f r r e e e e s s o o l l d d e e r r ( ( t t c c ) ) vol u me vol u me vol u me packa g emm 3 mm 3 mm 3 thickne ss <350 350 - 2000 >2000 <1.6mm 260 c 260 c 260 c 1.6 ?2.5mm 260 c 250 c 245 c >2.5mm 250 c 245 c 245 c reference jdec j-std-020d profile feat u re s tandard s np b s older lead (p b ) free s older pr e h ea t a n d s o a k t e mp e r a tur e min. (t smin ) 100 c 150 c ?t e mp e r a tur e m a x. (t sm a x ) 150 c 200 c ?tim e (t smin to t sm a x ) (t s ) 60-120 se con d s 60-120 se con d s av e r a g e r a mp up r a t e t sm a x to t p 3 c / se con d m a x. 3 c / se con d m a x. liqui d ous t e mp e r a tur e (t l ) 183 c 217 c tim e a t liqui d ous (t l ) 60-150 se con d s 60-150 se con d s p ea k p a ck a g e b o d y t e mp e r a tur e (t p ) * t ab l e 1t ab l e 2 tim e (t p ) ** within 5 c of th e sp e cifi ed cl a ssific a tion t e mp e r a tur e (t c ) 20 se con d s ** 30 se con d s ** av e r a g e r a mp- d own r a t e (t p to t sm a x )6 c / se con d m a x. 6 c / se con d m a x. tim e 25 c to p ea k t e mp e r a tur e 6 minut e s m a x. 8 minut e s m a x. * tol e r a nc e for p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum. ** tol e r a nc e for tim e a t p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum.
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